发明名称 CROSS LINKAGE FORMING POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a chemical amplification type cross linkage forming positive type photoresist composition having high resolution, excellent in etching resistance and capable of forming a resist pattern adaptable to a recent tendency to form a thinner film. SOLUTION: In the cross linkage forming positive type photoresist composition containing (A) a resin having alkali solubility increased by the action of an acid and (B) a compound which generates the acid when irradiated with radiation, the component (A) is a copolymer containing a constitutional unit of formula (a1) (where R is H or methyl), a constitutional unit of formula (a2) (where R is H or methyl), a constitutional unit of formula (a3) (where R1 is H or methyl, one of R2-R4 is a polycyclic saturated hydrocarbon group or two of R2-R4 form a polycyclic saturated hydrocarbon ring and the others are each lower alkyl) and a crosslinking type constitutional unit of formula (a4) (where R1 is H or methyl; R5 and R6 are each lower alkyli (n) is an integer of 1-3; and A is a single bond or a (n+1)-valent organic group).
申请公布号 JP2002062656(A) 申请公布日期 2002.02.28
申请号 JP20000250175 申请日期 2000.08.21
申请人 TOKYO OHKA KOGYO CO LTD 发明人 OMORI KATSUMI;KINOSHITA YOHEI;YAMADA TOMOTAKA;TAKAYAMA JUICHI
分类号 G03F7/039;C08F212/14;C08K5/00;C08K5/09;C08K5/17;C08K5/5333;C08L25/18;G03F7/004;H01L21/027 主分类号 G03F7/039
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