| 摘要 |
<p>PROBLEM TO BE SOLVED: To overcome the problems such that semiconductor chips bump against the wall surfaces of pockets provided in a chip tray by the transportation of the chip tray or the like, the chips are broken and the broken fragments of the chips are adhered to the surfaces of the chips and are turned into refuses when the chips are housed in the pockets provided in the chip tray. SOLUTION: A chip tray 10 is formed of a tray base 11 with the upper surface formed of a UV transmission synthetic resin into a tabular shape, a UV cured resin adhesive material layer 12 formed on the entire upper surface of the base 11 and a frame 13, which is fixed on the upper surface of the layer 12 and is formed with a plurality of window parts 15 of a dimension larger than the size of chips 14.</p> |
