| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC tag structure which makes it easy to peel a released paper off adhesion layer on both the surfaces of an IC tag and enables the released paper to be peeled off with a labeler. SOLUTION: The IC tag structure is composed of a surface film part which has at least one IC tag module part composed of at least an antenna part and an IC chip and covers the module part, both-surface adhesion layers which are adhered opposite to the surface film part, and the released paper which protects the both-surface adhesion layer; and the released paper is bent to the both-surface adhesion layers in the opposite direction from the surface film, so that the released paper can easily be peeled off the both-surface adhesion layers. |
