| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting or photosetting resin the composition of which gives a highly reliable hardened objects, with less cracks and which is useful as the peripheral material of electronic parts such as a semiconductor element by a build-up method, as a material for multilayer printed wiring board, for example, from high heat property and fine workability. SOLUTION: A photosetting or thermosetting resin composition for forming resin insulating layer in a printed wiring board includes 0.01 to 5 weight % of inorganic filler, such as silica sol whose average particle diameter is 5 nm to 0.5 μm with respect to 100 weight % of resin forming component including an optical or thermal polymer unsaturated compound. |
