| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin for a photoresist which can yield a photoresist having high heat resistance, high resolution and high sensitivity. SOLUTION: The phenolic resin is a novolak type phenolic resin obtained by reacting phenols (P) comprising 55-98 wt.% m-cresol, 1-20 wt.% p-cresol and 1-25 wt.% xylenol and/or trimethylphenol with aldehydes (F) comprising formaldehyde (f1) and an alkenyl-containing aldehyde (f2) in an f1 to f2 weight ratio of (1:9) to (9:1). The inertia radius (molecular size) of the novolak type phenolic resin is 1.50-2.50. |
