| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering system capable of directly measuring changes in the amount of target erosion with high precision when necessary after one stage of substrate processing while maintaining the vacuum of a vacuum vessel. SOLUTION: In the magnetron sputtering system with which a thin film is deposited on a substrate disposed to be opposed to the target in the vacuum vessel by using a magnetron sputtering phenomenon, an optical displacement sensor for measuring the amount of erosion of the target provided to the vacuum vessel is disposed, by means of a driving mechanism, insertably/detachably into/from the space between the target and the substrate which are disposed to be opposed to each other while maintaining the vacuum state of the vacuum vessel.
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