| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of simply and easily manufacturing a laminate type semiconductor module at a low cost. SOLUTION: An interlayer member 20 uses a prepreg 21. For forming conductive bumps 25 on the prepreg 21, through-holes 23 formed at specified positions are filled with a conductive paste 24. The through-hole 23 being open at both openings can prevent voids from being formed with filling the conductive paste 24, thereby improving the connection reliability. Compared with electroplating, a semiconductor module 1 can be manufactured simply and easily at a low cost. The prepregs 21 being half hardened and printed boards 2 are alternately laminated, heated and pressed to once melt and fluidize the prepregs 21 and they harden with time lapsed to adhere the printed boards 2 laid on the upside and downside. This eliminates the need of provision of adhesive layers and the semiconductor module 1 can be easily and simply manufactured at a low cost. |
