发明名称 |
Method and apparatus for polygonal heat slug |
摘要 |
An electronic package which has a polygonal shaped heat slug. The heat slug extends from a top surface of a package which has a plurality of vias. The package also has a number of capacitors that are mounted to the top surface. Some of the capacitors are located between the heat slug and the vias. The polygonal shape of the heat slug provides additional space on the top surface so that capacitors can be added without eliminating vias from the package.
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申请公布号 |
US2002023766(A1) |
申请公布日期 |
2002.02.28 |
申请号 |
US20010842305 |
申请日期 |
2001.04.25 |
申请人 |
CHRONEOS ROBERT J.;BANERJEE KOUSHIK |
发明人 |
CHRONEOS ROBERT J.;BANERJEE KOUSHIK |
分类号 |
H01L23/24;H01L23/36;H01L23/64;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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