| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor chip having a wiring for mounting without a disconnection of the wiring. SOLUTION: A diameterβof a land 143 is made within the range from 1.2 to 15 times the diameterαof a post 239. Since the land diameter is 1.2 or more times the post diameter, the land 143 is not delaminated from a first insulating layer 136 even if the post 239 is pulled by thermal contraction of a second insulating layer 236. The land diameter is 15 or less times the post diameter, so the possibility of delamination between the land 143 and the post 239 can be decreased by enlarging the land diameter.</p> |
