| 摘要 |
PROBLEM TO BE SOLVED: To provide a quartz bell jar of high reliability for semiconductor manufacturing equipment which can detect working limit easily without measuring thickness periodically. SOLUTION: The thickness of a quartz bell jar 10 is reduced gradually from an inner wall by etching gas which is introduced to the inside. A recess region RCS formed in a part of the surface of an outer wall of the bell jar 10 has a thickness T1 regulating the working limit of the bell jar 10. A protruding type quartz segment 11 is buried in the recess region RCS and fixed. At least a surface of the quartz segment 11 which is bonded to the recess region RCS surface is a blast surface BLS subjected to blast treatment so as to form a roughened surface (dulling). The whole of the bell jar has a thickness greater than the thickness including the fixed quartz segment 11 and regulating the working limit.
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