| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer semiconductor module whereby the connection reliability can be improved. SOLUTION: An interlayer member 20 has through-holes 23, each having a downside opening 23B diameter larger than an upside opening 23A diameter as a tapered inner wall. As the result, a second conductive bump 25B formed on the lowerside has a larger diameter than that of a first conductive bump 25A formed on the upperside and is connected to a connecting bump 13 on a printed board 2. If a displacement occurs due to pressing during laminating, the displacement error can be absorbed to ensure a good connection between both bumps 13, 25B. |
