COMPOSITE WIRING BOARD AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To solve the problem that conventionally the rate which the mounting area of a connector occupies is ignored from the request of high density mounting in recent years, since a conventional multilayer substrate does not have bendability and it cannot be arranged freely, since it is thick and it is general to use the connector at electrically connection of rigid wiring boards by the bending wiring board. SOLUTION: The wiring of a ridge wiring board part and the wiring of the bending wiring board part are electrically connected by a conductor with which the through-hole of a film base material is filled. Bendability can be given between the rigid wiring boards and they can electrically be connected without using the connector and the like in the film base material. Thus, high density mounting is realized.