| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface roughening treating solution for copper surfaces for firmly adhering a copper surface and a high polymer material in the production of a printed wiring board or the like. SOLUTION: This surface roughening treating solution for copper and copper alloys contains hydrogen peroxide, inorganic acid, azoles such as benzotriazole and at least one kind of organic acid selected from glycolic acid, malonic acid and glutaric acid. |
