| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inexpensively manufacturing compact and thin photoelectronic components in large quantities in unit time. SOLUTION: This method includes a step (S12) that forms a groove on the surface of a semiconductor substrate where a plurality of LED chips are formed, and a bump is formed to each LED chip, first and second steps (S14 and S18) that apply transparent resin onto the surface and backside of the semiconductor substrate where the groove is formed, respectively, and a step (S24) that cuts a position where the groove is formed for dividing into each photoelectronic component. |
