| 摘要 |
PROBLEM TO BE SOLVED: To carry out cleavage with higher positional accuracy than before. SOLUTION: After an element, such as an active region 102 has been formed on a crystalline substrate 101, a sub guide groove 108 is successively formed on a main guide groove 107, the blade of a wedge-like tool 106 is applied to the back of the substrate 101 at the forming section, and prescribed force is applied to the direction of the tool 106 from the upper section of the substrate 101, thus cleaving the substrate 101.
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