DEVICE AND METHOD FOR FORMING COATED FILM

摘要

PROBLEM TO BE SOLVED: To reduce the labor of the work required for calculating the approximate expression used for correcting the number of revolutions of the spin chuck of a coated film forming device. SOLUTION: When a number-of-revolution setting section inputs the initialization required for drawing-up a spin curve, the number of required wafers and the number of revolutions at every wafer are decided based on the initialization. Then the coating of each wafer is automatically performed, and data composed of the number of revolutions for shaking off the wafer and the measured film thickness value at the number of revolutions are obtained. A spin curve drawing-up section is provided with an approximate expression selecting section and the operator of the coated film forming device decides an approximate expression (spin curve) by selecting arbitrary one out of a plurality of approximate expressions based on the data. When a film thickness measurement unit decides that the film thickness of a resist film deviates from a target film thickness, the number of revolutions is corrected based on the decided approximate expression and the film thickness of the resist film is corrected to the target film thickness.