发明名称 Heat-processing apparatus and method for semiconductor process
摘要 A vertical heat-processing apparatus includes a surrounding member, which surrounds a process chamber and a heater. The surrounding member forms a heating space around the process chamber. The heating space has zones juxtaposed in a vertical direction. Temperature sensors are arranged to detect temperatures respectively representing the zones. Supply pipes are arranged to respectively supply a cooling gas to the zones. The supply pipes are respectively provided with valves controlled by a controller. The controller adjusts opening degrees of the valves such that a flow velocity of the cooling gas in a first zone having a lower cooling rate becomes higher than a flow velocity of the cooling gas in a second zone having a higher cooling rate used as a reference.
申请公布号 US2002025688(A1) 申请公布日期 2002.02.28
申请号 US20010932942 申请日期 2001.08.21
申请人 KATO KAZUHIKO 发明人 KATO KAZUHIKO
分类号 F27B5/18;H01L21/00;H01L21/205;H01L21/22;H01L21/324;(IPC1-7):H01L21/31;H01L21/469 主分类号 F27B5/18
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