HIGH MOLECULAR WEIGHT EPOXY RESIN AND RESINOUS COMPOSITION FOR PRINTED CIRCUIT BOARD

摘要

The present invention provides a high molecular weight epoxy resin containing highly pure bisphenol S without bromine, a resinous composition comprising the high molecular weight epoxy resin, and a resinous composition for a printed circuit board comprising the resinous composition. [Solving Means] A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100 % by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.