| 摘要 |
<p>An electrical interconnection structure for a flip chip is produced for a flip chip having a plurality of chip bond pads in electrical connection with an electronic circuit, whit the chip bond pads provided on a first face of the flip chip. Electrically-conductive polymer bump bond pads are formed on the first face of the flip chip in an arrangement selected for electrical interconnection of the flip chip with a substrate. A plurality of electrically-conductive polymer redistribution traces are formed on the first face of the flip chip, each trace electrically connecting a chip bond pad to a bump bond pad. The electrically-conductive polymer bump bond pads and redistribution traces can be provided together of a common patterned electrically-conductive polymer layer by, e.g., stencilling or screen printing, to enable in one geometrically defined layer bot redistribution traces and interconnection bump bond pads. Historically, redistribution traces and bump bond pads have been provided as a metal layer, e.g., an aluminium layer, formed by, e.g., a sputtering or other metal deposition process, and geometrically defined by a separate photolithography technique. Employing an electrically-conductive polymer layer rather than a metal layer, the invention overcomes the limitations of a metal layer and expands the range of applications that are addressed by a flip chip bond pad redistribution configuration.</p> |
