| 摘要 |
<p>The present invention provides a carrier (12) that provides improved retention to the individual contact elements (16) resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier (12), which includes upper and lower sections (44,46) of dielectric material with an adhesive layer (48) in between, includes a plurality of openings (56), each of which may contain an individual contact element (16). During assembly of the connector (10), once the contact elements (16) are inserted, the adhesive layer (48) is reflowed, thereby allowing the carrier (12) to capture the location of the contact elements (16) both with respect to each other as well as to the carrier (12). Alternately, the carrier (12) may be implemented in a fashion that, while not including an adhesive layer (48) to be reflowed, still provides improved retention of the individual contact elements (16). These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes. Description of the processes to assemble the carrier and overall connector are also disclosed.</p> |
