| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator which attains reduction of an occupied area by three-dimensionally locating a packaged crystal vibrator above a wiring board while dealing with mass-production based on batch processing by enabling screen printing of cream solder on a land on the wiring board by adopting a plate-like substrate as a wiring board to package electronic components, concerning a piezoelectric oscillator provided with a configuration fixing the packaged piezoelectric vibrator at the upper part of a package part to package the electronic components constituting an oscillation circuit or temperature compensating circuit. SOLUTION: While using pillar members 43 integrated on the bottom of a piezoelectric vibrator 41 or pillar members 50 as separate bodies, these pillar members 43 and 50 are electrically and mechanically connected to patterns 36 for pillar member fixing on a wiring board 32.
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