| 摘要 |
<p>A dual switch architecture (200) for mixed packet and circuit transports over SONET and SDH and DWDM is provided. The dual switch architecture includes a TDM circuit cross connect module (210), a packet switch module (220), interface modules (230) with one or more ports, a bi-directional TDM bus (215) between the TDM circuit cross connect module and the packet switch module, a point-to point, bi-directional TDM connection (280) between each interface module and the TDM circuit switch module, and a point-to point, bi-directional packet connection (290) between each interface module and the packet switch module.</p> |
