| 摘要 |
<p>An electroless displacement gold plating solution which comprises a water-soluble gold compound, a complexing agent and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble silver compound, or a combination thereof; an additive for preparing the plating solution; and a metal composite material produced by the treatment with said plating solution. The gold plating solution is excellent in stability and thus, even after an elapsed time of a given long period, can be used for the production of a metal composite material exhibiting a homogeneously plated appearance and also having a thick gold coating film.</p> |
