Method for inspection of circuit boards and apparatus for inspection of circuit boards

摘要

The present invention is to propose a circuit board inspection method and its apparatus in which extraction of all of minute parts placed on a circuit board is possible without being influenced by an amount of deformation of the circuit board; according to the present invention, the method for inspecting the circuit board comprises a step of measuring a 3-dimensional shape of the circuit board which is an inspection object and making it to be a surface-shape measurement data, a step of automatically estimating the amount of deformation of the circuit board from measured surface-shape measurement data of whole of the surface of the circuit board, a step of automatically generating an approximated curved surface of the circuit board from an estimated result of the above-mention step, and a step of performing a subtraction process between the approximated curved surface generated in the abovementioned step and the surface-shape measurement data; the apparatus for inspecting the circuit board comprises processing sections for performing the above-mentioned respective steps.