| 摘要 |
PROBLEM TO BE SOLVED: To realize insulation and sealing of an IC card with superior flatness, strength, durability, and reliability at a low cost. SOLUTION: The stepped space formed of the IC 4 and the top surface of a substrate 2 is filled with paste 17 made of thermosetting resin or photosetting resin, pigment, powder resin, etc., as a sealant 19 and spacer balls 18 are mixed with the sealant 19; and the paste 17 is hardened at the same time with the thermocompression bonding of a laminate sheet 10 or a compression bonding or decorative coating 25 of the sheet 10 is applied onto the hardened paste 24 after the paste is hardened by energy-beam irradiation. |
