| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing apparatus for polishing two sheets of substrates simultaneously with use of a single polishing platen by nearly the same polished amount for the two substrates. SOLUTION: In the apparatus for polishing two sheets of substrates at their surfaces simultaneously, the two substrates w1 and w2 held on respective heads 25 and 25 are pushed against an identical polishing platen 11, and substrates and platen are slid with intervention of polishing solution 51, and the platen or heads are rocked horizontally in a reciprocative manner. A straight line connected between central point of the two substrates lies on a vertical plane including a central point of the platen, a polishing device 30 capable of moving the heads or platen in a horizontal direction vertical to the vertical plane is used to measure polished amounts t1 and t2 for the substrates w1 and w2 for test polishing. In actual polishing, the platen or heads are moved in their rocking center so that one of the substrates held to one of the heads holding the substrate with a smaller polishing amount comes closer to an outer peripheral side of the platen, and then polishing is started. |
