| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of electronic components for sealing formation by setting a substrate to the cavity of a forming die without any misalignment. SOLUTION: The substrate 2 where a plurality of electronic devices 1 are packaged onto the surface is set into the cavity of the forming die, and at the same time a sealing resin is impregnated into the forming die, thus carrying out the sealing formation of the electronic devices 1 on the surface of the substrate 2 before cutting and dividing the substrate 2, and hence manufacturing the electronic components where each electronic device 1 is independent. At this time, the external dimensions of the substrate 2 are formed to be elastically expanded and contracted for adjustment, and are adjusted for setting the substrate 2 to the cavity of the forming die. |
