发明名称 Multilayer circuit board and method of manufacturing the same
摘要 In the multilayer circuit board, cable patterns in a plurality of cable layers can be precisely formed, and the cable layer are formed with higher density, with higher reliability. The multilayer circuit board comprises: a plurality of cable layers, each of which includes electric conductive sections; a plurality of first insulating layers, each of which encloses the electric conductive sections in each cable layer and fills spaces between the electric conductive sections; and post vias electrically connecting the electric conductive sections in one cable layer to those in another cable layer. Height of the electric conductive sections in each cable layer are equal to that of the first insulating layer enclosing those electric conductive sections.
申请公布号 US2002023895(A1) 申请公布日期 2002.02.28
申请号 US20010789771 申请日期 2001.02.22
申请人 FUJITSU LIMITED 发明人 IIDA KENJI
分类号 H05K3/04;H05K3/10;H05K3/24;H05K3/46;(IPC1-7):H01B13/00 主分类号 H05K3/04
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