PALLADIUM ELECTROPLATING BATH AND ELECTROPLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a palladium electroplating method free from the problems of the conventional method. SOLUTION: This electroplating bath includes a metal-sulfonic acid complex (where the metal is a noble metal) and free sulfonic acid. This noble metal includes Pd, Au, rigid Au (containing Ni or Co as a hardener), Pt, Rh, Ru and Ag and their alloys.