发明名称 INTERPOSER FOR USE IN ELECTRONIC PACKAGES
摘要 <p>An electrical interposer is provide for interface between an LGA (24) and a mother board (34). The interposer includes a spacer (60) with stepped opening (64) for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides nobel metal plated contact pads (66) on a first surface to receive the contact members of LGA connector and contact pads (70) for BGA solder connections for attachment to the mother board.</p>
申请公布号 WO2002017438(A1) 申请公布日期 2002.02.28
申请号 US2001025395 申请日期 2001.08.14
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