Heat fusion bonding of electrically conductive filler carried in heat curable adhesive to form electrical and mechanical bond to at least one electrode

摘要

A bonding method comprises preparing a conductive adhesive containing an electrically conductive filler and an organic binder, coating the adhesive on an electrode formed on the surface of a substrate and melting the surface of the electrode to form a fused bond between the surface of the electrode and the electrically conductive filler, and curing the organic binder to complete both an electrical and mechanical bond between electrode and adhesive. Further disclosed is the formation of a mechanical and electrically conductive path between two electrodes by using the above described process to bond a second electrode to the free end of the adhesive. The organic binder may comprise a thermosetting resin. The surface of the electrode may carry a plated layer of a low melting point material such as tin or lead to aid the fusion bonding. (No reference numerals provided in specification).