发明名称 |
HIGH-DENSITY INTERCONNECT TECHNIQUE |
摘要 |
<p>A high density interconnect system (30) employs contact fingers (32) on both surfaces (34) and (36) of burn-in PCB (38), feed-through PCB (40) and driver PCB (42). Each of the PCBs (38), (40) and (42) has a card-edge connector (44), (46) and (48). The feed-through PCB (40) has a second card-edge connector (40) and a second set of contact fingers (32), since it mates with both the burn-in PCB (38) and the driver PCB (42). The contact fingers (32) and the card-edge connectors (44), (46), (48) and (50) of each PCB (38), (40) and (42) mate inversely with each other on adjacent PCBs, i.e., the card-edge connector (44) of the burn-in PCB (38) mates with the contact fingers (32) of the feed-through PCB (40), and the card-edge connector (46) of the feed-through PCB (40) mates with the contact fingers (32) of the burn-in PCB (38), for example. The same relationship exists between the card-edge connector (50) of the feed-through PCB (40), the card-edge connector (48) of the driver PCB (42) and the contact fingers (32) of the feed-through PCB(40) and the driver PCB (42).</p> |
申请公布号 |
EP0731992(B1) |
申请公布日期 |
2002.02.27 |
申请号 |
EP19950900537 |
申请日期 |
1994.11.04 |
申请人 |
AEHR TEST SYSTEMS, INC. |
发明人 |
BARRACLOUGH, WILLIAM, D.;ALPERIN, MIKHAIL, A.;BREHM, JEFFREY, A.;HOANG, JOHN, DINH;SHEPHERD, PATRICK, M.;TOMIC, JAMES, F. |
分类号 |
A61K31/70;G01R31/28;H01R12/72;H05K1/14;(IPC1-7):H01R12/04;H01R12/20;G01R31/316;H01R12/18 |
主分类号 |
A61K31/70 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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