High speed circuit board interconnection

摘要

The invention is a device which includes at least one circuit board (12) having major surfaces (13, 14) with a signal pin hole (31), a ground pin hole (32), and a pattern of via holes (34-37) extending between the surfaces. The via holes surround the signal pin hole and are electrically connected to a DC ground plane (15) formed in the board. A ground pin (16) and signal pin (17) are mounted within the ground pin hole and signal pin hole, respectively, and extend past at least one of the surfaces. In one embodiment, a conductive shield (18) surrounds at least a portion of the signal pin extending past the surface. In another embodiment, the shield can be omitted.