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发明名称
METHOD AND LAMINATE FOR FABRICATING AN INTEGRATED CIRCUIT
摘要
申请公布号
EP1181719(A1)
申请公布日期
2002.02.27
申请号
EP20010905110
申请日期
2001.01.26
申请人
PHILIPS SEMICONDUCTORS INC.;KONINKLIJKE PHILIPS ELECTRONICS N.V.
发明人
GABRIEL, CALVIN, TODD;ZHENG, TAMMY, D.;MUIZON, EMMANUEL, DE;LEARD, LINDA, A.
分类号
H01L21/28;H01L21/3065;H01L21/8238;H01L27/092;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/823
主分类号
H01L21/28
代理机构
代理人
主权项
地址
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