发明名称 |
Electronic component for surface mounting (SMT) |
摘要 |
The component has an insulating carrier element (10) and at least one electrically conducting conductor element (20) attached to it with a contact region (22) lying freely outside the carrier element to enable the component to be connected to a circuit board (30). At least one window (16) in the carrier element enables infrared radiation to pass through to the contact region. The window is an opening in the carrier element. The conductor element passes through the carrier element to form the contact region on one side of the carrier element and a free-lying contact part (24) on the other side of the carrier element. |
申请公布号 |
EP0743716(B1) |
申请公布日期 |
2002.02.27 |
申请号 |
EP19960107103 |
申请日期 |
1996.05.06 |
申请人 |
OTTO DUNKEL GMBH FABRIK FUER ELEKTROTECHNISCHE GERAETE |
发明人 |
OBERSTARR, REINHARD |
分类号 |
H01C1/14;H01R4/02;H01R12/55;H01R12/57;H05K3/34 |
主分类号 |
H01C1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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