METAL INTERCONNECTIONS AND ACTIVE MATRIX SUBSTRATE USING METAL INTERCONNECTIONS

摘要

PURPOSE: A metal interconnection and an active matrix substrate using the metal interconnection are provided to obtain an active matrix substrate of high yield rate and reliability by preventing the generation of a residual film and disconnection. CONSTITUTION: A ground pattern film(12) for interconnections is formed on a glass substrate(11), and a plating film(13) is formed by selective plating on the ground pattern film. A taper angle(alpha) formed by both sides of the plating film and the surface of the glass substrate is made in the range of zero to 90 degrees. Since new interconnections are formed on the plating film without disconnection, a residual film is not generated. Moreover, patterning of new films on the plating film is possible.