| 摘要 |
An assembly for electrically connecting together various miniaturized electrical components is disclosed and generally includes a planer surface, such as a mother board, which supports the electrical components as well as at least one thin insulating strip lying in a plane extending perpendicular to the surface and defining a plurality of apertures arranged in accordance with a predetermined circuit plan. A plurality of spaced-apart electrically conductive posts and at least one electrically conductive rail are mounted on opposite sides of the insulating strip and extend in transverse directions so as to cross the aforesaid apertures in accordance with the predetermined plan. In this manner, preselected posts are welded to preselected rails through commonly crossed apertures, and are also electrically connected to the various electrical components which thereby connect these components together in accordance with the aforestated predetermined circuit plan.
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