发明名称 METHOD AND DEVICE FOR LASER BEAM MACHINING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and a device for laser beam machining for making a hole on a work with a laser beam, by which method and device the power of the laser beam source is smaller than that of a case where the laser beam machining is performed by making a work irradiated with the laser beam, whose diameter corresponds to the planned diameter of a hole to be made on the work, and by focusing the laser beam on the work, and the machining time is shorter than that of a case where the laser beam machining is performed by making the work irradiated with a laser beam, whose diameter is smaller than that of the hole to be made, by being scanned along the periphery of the circle of the hole to be made. SOLUTION: The laser beam emitted from a YAG laser oscillator passes through an aperture 111, as shown by a chain double-dashed line in the figure, its optical path is bent by 90 degree at a vertical reflecting mirror 112, then the laser beam enters into a conical mirror 113, and is emitted in a form of a ring laser beam. Further, the ring-formed laser beam emitted from the conical lens 113 is converged by an fθlens 114, and irradiated as a ring-formed laser beam L having a predetermined width S vertically downward with respect to a work W.</p>
申请公布号 JP2002059287(A) 申请公布日期 2002.02.26
申请号 JP20000245419 申请日期 2000.08.11
申请人 RICOH MICROELECTRONICS CO LTD 发明人 KOBAYASHI TAKESHI;MIYAMOTO KAZUNORI
分类号 B28D5/00;B23K26/06;B23K26/073;B23K26/12;(IPC1-7):B23K26/06 主分类号 B28D5/00
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