Pad for integrated circuit device which allows for multiple probing and reliable bonding and integrated circuit device including the pad

摘要

An integrated circuit device having a first type of pads with a probing portion and a bonding portion. The integrated circuit device includes a memory cell array, a logic circuit, and a plurality of the first type of pads and a plurality of a second type of pads. The second type of pads are electrically connected to the logic circuit. The first type of pads are electrically connected to the memory cell array and the logic circuit. Only the probing portion of the first type of pads is contacted by probes during testing of the memory cell array, and the bonding portion is used exclusively for attachment of a bond wire to permit connection to an external system.