Flip-chip type assembly connection with elastic contacts for mounting integrated circuits

摘要

The assembly connection comprises at least a flip-chip (214) and a substrate (202). The substrate has an elastomer bump structure (204) moulded by using anisotropically etched silicon as a mould. The chip has pads, the pattern of the bumps corresponding to the pad pattern on the chip. The substrate has a guiding frame (212) and the chip an edge, the frame having the same shape as the edge of the chip. The bumps may be coated with gold and act as both electrical contacts (206) and as guides for vertical positioning.