| 发明名称 |
Power distribution printed circuit board for a semiconductor processing system |
| 摘要 |
A semiconductor processing system including a printed circuit board structure for delivering power to an assembly of radiant energy sources. The printed circuit board structure, in one configuration, forms an evacuable housing for the assembly of radiant energy sources.
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| 申请公布号 |
US6350964(B1) |
申请公布日期 |
2002.02.26 |
| 申请号 |
US20000710518 |
申请日期 |
2000.11.09 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BOAS RYAN C.;STEFFAS PAUL J. |
| 分类号 |
H01L21/00;(IPC1-7):F27B5/14 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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