EPOXY RESIN COMPOSITION, PREPREG USING THE SAME, METAL- CLAD LAMINATE, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To secure the adhesive strength between a metal foil for printed wiring and an insulation layer integrally bonded thereto when the layer is formed by impregnating an epoxy resin composition into a substrate which is prepared from poly-p-phenylene 3,4'-diphenyl ether terephthalamide fibers or prepared by using the fibers as the main ingredient and a component selected from among p-aromatic polyamide fiber pulp, m-aromatic polyamide fiber chops, and m-aromatic polyamide fibrids as a binder. SOLUTION: The epoxy resin composition to be impregnated into the substrate is prepared so that the equivalent ratio of a curing agent to epoxy groups is 0.5 or higher and lower than 1.0, preferably 0.7 or higher and lower than 0.95.