Substrate removal as a function of sonic analysis

摘要

Substrate removal for post-manufacturing analysis of a semiconductor device is enhanced via a method and system that use sonic energy in the control of the removal process. According to an example embodiment of the present invention, sonic energy is reflected off of a region of a semiconductor chip having a portion of substrate removed from the back side of the chip. The reflections are detected and used to determine the thickness of substrate in the back side. In this manner, the substrate removal process can be efficiently and accurately controlled.