| 摘要 |
PROBLEM TO BE SOLVED: To provide a polished work holding material to prevent growth of scratches of a polished article even though it is thin concerning the polished work holding material as a jig to polish the thin plate type polished work such as a silicon wafer, etc. SOLUTION: This holding material is furnished with a base layer B made by soaking a base material made of organic fiber in resin and a surface film layer F accumulated on a surface of this base layer B, and this surface film layer F is made of an organic resin film of a tensile elastic modulus of more than 4000 N/mm2. |
