| 摘要 |
PROBLEM TO BE SOLVED: To maintain the release property of a release film for a long time by preventing counter diffusion between the base material of a die and the release film in the molding die for glass. SOLUTION: A diffusion preventing film 2 is applied on the base material 1 and the release film 3 is applied thereon. In the example, the base material 1 consists of a tungsten carbide (WC) sintered body and contains 3 wt.% titanium carbide(TiC) but no metal binder. The diffusion preventing film 2 is formed by sputtering niobium(Nb) to 0.05μm thickness. The release film 3 is formed by sputtering an alloy of platinum(Pt) and iridium(Ir) to 0.3μm thickness. As for the diffusion preventing film 2, not only Nb but a high melting point metal such as Ta, Hf, Zr, Re, Ir, Mo, Rh, Ru and Os can be used.
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