| 发明名称 |
Increased polish removal rate of dielectric layers using fixed abrasive pads |
| 摘要 |
A method for polishing a dielectric layer containing silicon provides a fluorine-based inorganic compound during a polishing process. The dielectric layer is polished in the presence of the fluorine based compound to accelerate a polishing rate of the dielectric layer.
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| 申请公布号 |
US6350692(B1) |
申请公布日期 |
2002.02.26 |
| 申请号 |
US20000737198 |
申请日期 |
2000.12.14 |
| 申请人 |
INFINEON TECHNOLOGIES AG;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ECONOMIKOS LAERTIS;RAMACHANDRAN RAVIKUMAR;SIMPSON ALEXANDER |
| 分类号 |
H01L21/3105;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/3105 |
| 代理机构 |
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