发明名称 Separably bondable shunt for wireless suspensions
摘要 The invention provides continuing shunt protection of wireless suspension assemblies with a shunt structure that is readily attached to and detached from the contact pads or other exposed areas of the conductive traces of the flexible conductive laminate portion of the wireless suspension for use as needed to protect the MR and GMR elements/heads. The shunt structure comprises a conductive web to connect the conductive traces in parallel, and adhesive allowing the separable attachment of the web to the traces. The metal or metal deposited conductive web has varying geometries of conductive areas and adhesive areas to allow conductive web attachment to the proximate contact pads of the suspension, to be removed during testing and left on during assembly and between tests to nearly continually protect the head magnetoresistive element, or, to provide continuous ESD protection for the MR and GMR element attached to a flexible conductive circuit, to allow conductive web attachment to the traces beyond the contact pads such that the web is left in place during suspension assembly, during testing and between tests.
申请公布号 US6351352(B1) 申请公布日期 2002.02.26
申请号 US19990349413 申请日期 1999.07.06
申请人 MAGNECOMP CORP. 发明人 KHAN AMANULLAH;COON WARREN
分类号 G11B5/40;G11B5/48;G11B5/596;H05K1/02;(IPC1-7):G11B5/54;G11B5/012 主分类号 G11B5/40
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