| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive silicone rubber composition which has good adhesive property between semiconductor chips and attached members, does not deteriorate the adhesive performance with the passage of time, does not cause troubles such as the deterioration of adhesive reliability between semiconductor chips/bonding wires or between the bonding wires/lead frame, the deterioration of the adhesion of sealing materials to semiconductor chips, attached portions, and lead frames, and the deterioration of moisture resistance of the device, and can thereby well be used as an adhesive (dye bonding agent) for attaching the semiconductor chips. SOLUTION: This adhesive silicone rubber composition comprising (1) an organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule, (2) an organohydrogen polysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule, (3) an adhesive property-imparting agent, and (4) an addition reaction catalyst, characterized in that a 11 to 50 Si atom cyclic or linear low molecular nonfunctional siloxane content is <=3 wt.%.</p> |
