发明名称 Spray cooling system
摘要 A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.
申请公布号 US6349554(B2) 申请公布日期 2002.02.26
申请号 US20000735415 申请日期 2000.12.11
申请人 HEWLETT-PACKARD COMPANY 发明人 PATEL CHANDRAKANT D.;BASH CULLEN E.
分类号 F25D17/02;F25B39/02;F25B39/04;F25D9/00;H01L23/473;H05K7/20;(IPC1-7):F25D23/12 主分类号 F25D17/02
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