Heat sink for integrated circuit packages

摘要

An integrated circuit heat dissipator is comprised of a unitary piece of metallic material for dissipating thermal energy generated by semiconductor devices encapsulated in a DIP integrated circuit package. The heat dissipator is adapted to accept heat conducting pins of the integrated circuit. Soldering secures the heat dissipator and the integrated circuit heat conducting pins to each other and to the printed circuit board. A bulk mass of heat conducting solder is retained at the connection of the heat dissipator and the heat conducting pins for enhancing the heat sinking of the pins by the heat dissipator.